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AI chip battleground shifts from computation to interconnection as Samsung and SK bet on packaging

The performance competition in AI semiconductors is expanding beyond improving computing power through fine fabrication processes to how quickly and efficiently memory and computing chips are connected. As computing performance of AI accelerators rises rapidly while memory bandwidth and inter-chip data transfer speeds fail to keep pace, advanced packaging ha..

Lotte E&C collaborates with 8 startups to test AI and robotics technologies on site
Lotte E&C is expanding its open innovation initiative by partnering with public institutions to apply startups' new construction technologies to actual..

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