0
Shim Ho-jun, Vice President of the AE Team in the Memory Business at Samsung Electronics' DS Division, delivers a presentation at the OCP Global Summit 2026 held in Silicon Valley, California, on October 12 (local time). / Samsung Electronics

Samsung Electronics unveiled its next-generation artificial intelligence (AI) memory strategy and collaborative milestones with global partners at the OCP Global Summit 2026. The company presented technologies aimed at enhancing overall AI system efficiency, spanning high-performance memory, capacity expansion, and data storage and management.

On the 13th, Samsung Electronics announced that it participated as a Diamond Sponsor—the highest sponsorship tier, continuing from last year—at the OCP Global Summit 2026, which opened on the 12th (local time) in Silicon Valley, California.

The OCP Global Summit brings together IT, semiconductor, server, and data center companies to discuss open hardware technologies, standardization, and the future trajectory of AI infrastructure.

During his presentation, Shim Ho-jun, Vice President of the Application Engineering (AE) Team in the Memory Business at Samsung Electronics' Device Solutions (DS) Division, explained that as AI models scale up and data volumes processed during inference expand, memory bandwidth must be matched by advances in capacity expansion and data storage and management technologies.

Samsung Electronics outlined three technological directions to address these shifts: boosting data processing performance and computational efficiency through HBM5, customized HBM, and Processing-in-Memory (PIM); expanding memory capacity through Compute Express Link (CXL)-based architectures; and enhancing storage performance and management efficiency for massive AI datasets by leveraging next-generation SSDs and high-capacity NAND technology.

At the summit, the company is conducting a joint demonstration of a CXL-based memory expansion solution with AMD. The setup utilizes CMM-D-based memory pooling technology to enable multiple systems to share and utilize memory resources efficiently. The joint demo carries significance as it validates the technology within real-world system environments alongside a global computing platform leader, while expanding cooperation to optimize AI infrastructure performance.

Beyond enhancing standalone memory and storage product performance, Samsung Electronics is showcasing an open collaboration strategy at OCP focused on co-designing AI systems with global clients and partners and validating technologies in operational environments.

Earlier this year, Samsung Electronics also showcased its next-generation memory and storage products and technologies at events including GTC, Computex, and FMS. Leveraging a comprehensive portfolio spanning HBM, system memory, SSDs, and NAND flash, the company plans to continue deepening collaboration with AI infrastructure customers.

                                                                                                              Kim Han-seul