SK hynix unveils cooling-integrated HBM for AI systems

May 26, 2026, 09:14 am

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SK hynix’s conceptual diagram of its iHBM package solution. /SK hynix

SK hynix has unveiled a new high-bandwidth memory (HBM) technology integrating cooling functions directly into the package, aiming to address rising heat issues in AI memory systems and strengthen its next-generation AI semiconductor competitiveness.

The company announced on Monday that it had developed “iHBM (Integrated HBM),” a technology designed to effectively control heat generated inside HBM packages. As HBM performance rapidly improves through higher stacking and faster speeds, thermal management has become increasingly critical for maintaining stable operations.

In particular, heat density in the D2D PHY section connecting HBM and GPUs has emerged as a major challenge in AI computing systems.

Conventional HBM structures dissipate heat externally through the core die, but iHBM applies “ICE (Integrated Cooling Elements)” within the D2D PHY region, where heat concentration is highest, creating a dedicated heat dissipation path.

ICE consists of silicon-based cooling structures that do not conduct electricity but have high thermal conductivity. SK hynix said the technology reduces thermal resistance by more than 30% compared with existing solutions, ensuring stable performance even under high-temperature and high-workload conditions.

The company also emphasized mass-production competitiveness. By adopting a market-proven MR-MUF wafer-level packaging process, iHBM enables stable large-scale manufacturing while maintaining high compatibility with existing integrated system package designs, minimizing the need for major customer-side design changes.

SK hynix said it is considering applying the technology to next-generation products, including HBM5. The company expects the solution to improve system stability and power efficiency in AI data centers and high-performance computing (HPC) environments that require highly integrated ultra-high-bandwidth memory.

Lee Kang-wook, Vice President and Head of Package Development at SK hynix, said, “iHBM is a solution that minimizes heat issues by combining advanced memory design and packaging technologies,” adding that the company will continue strengthening its AI memory leadership by proactively meeting customer demands in the AI era.

#SK hynix #iHBM #HBM #high-bandwidth memory #AI memory