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Hanmi Semiconductor has shipped its FC Bonder 75. / Courtesy of Hanmi Semiconductor

Hanmi Semiconductor has made its first shipment of the FC Bonder 75, equipment designed to support 2.5D packaging for artificial intelligence semiconductors, to a global customer.

The move marks the company’s push to strengthen its presence in the 2.5D system semiconductor packaging market following its expansion in high-bandwidth memory.

Hanmi Semiconductor said on Sept. 22 that it had shipped the FC Bonder 75, which supports large interposer packaging.

The equipment can handle packages measuring up to 75 mm by 75 mm, significantly larger than the conventional 20 mm by 20 mm semiconductor package size. This enables the use of ultra-large dies and multi-chip integration required for next-generation AI semiconductors.

As AI chips become more advanced, 2.5D packaging technology that integrates multiple semiconductors such as central processing units, graphics processing units and HBM into a single package is drawing greater attention.

The size of interposers and substrates is also increasing. As a result, packaging equipment is becoming more sophisticated, while demand is rising from foundries and outsourced semiconductor assembly and test, or OSAT, companies, according to Hanmi Semiconductor.

Alongside the FC Bonder 75, Hanmi Semiconductor is expanding its lineup of 2.5D packaging equipment.

This year, the company launched the FC Bonder 3.5, 2.5D TC Bonder 40 C2S and 2.5D TC Bonder 40 C2W, and is preparing to launch the 2.5D TC Bonder 120.

Hanmi Semiconductor also plans to create synergies with the establishment of its U.S. subsidiary, Hanmi USA, scheduled for October.

Through the subsidiary, the company aims to respond to demand from U.S.-based AI Big Tech companies, foundries, OSAT firms and memory chipmakers that are expected to begin full-scale operations in 2028.

“We are expanding our technological competitiveness by supplying not only TC bonders for HBM, but also TC bonding equipment for AI packages and various other packaging systems to customers,” a Hanmi Semiconductor official said.

“We will continue to achieve sales growth.”

                                                                                                               Choi In-gyu