Samsung to mass-produce 12-layered HBM3E in Q2
AsiaToday reporter Jeong Moon-kyungSamsung Electronics announced that it will start mass production of 12-layered HBM3E chips, a high-bandwidth DRAM optimized for the generative AI era, in the second quarter. Its move to mass production comes quickly after it announced back it February that it successfully developed the industry’s largest 12-layer DRAM. Sinc..